The MasterAir G100M Heat column technology is a two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. The fluid is transferred by the copper powder filled inside the column creating an anti-gravity heat transfer.
Super quick heat transfer is made possible with Heat Column at a massive Ø41.2, the equivalent of 7X the size of traditional heatpipes. The unification of heatpipes and base into one unit captures and effiicienty transfers the heat from CPU like never seen before
The low profile G100M stands at 74.5mm, a great fit for slim PC cases, including mini-ITX cases. Even at these small dimensions, the heatsink has cooling capacity of 130W TDP.
A high peformance 92mm PWM fan with a range of 600 ~ 2400 RPM, cools not only the CPU, but all surrounding components inside the case for exceptional thermal results.
Weight & dimensions
|Fan dimensions (W x D x H)||145 x 154 x 74.5|
|Heatsink dimensions (W x D x H)||143 x 143 x 51.7|
|Supported processor sockets||LGA 1151 (Socket H4),LGA 1155 (Socket H2),LGA 1156 (Socket H),LGA 1366 (Socket B),LGA 2011 (Socket R),LGA 2011-v3 (Socket R),LGA 2066,LGA 775 (Socket T),Socket AM2,Socket AM2+,Socket AM3,Socket AM3+,Socket AM4,Socket FM1,Socket FM2,Socket FM2+|
|Rotational speed (min)||600|
|Rotational speed (max)||2400|
|Maximum air pressure||1.6|
|Pulse-width modulation (PWM) support||Y|
|Mean time to failure (MTTF)||280000|
|Power consumption (typical)||4.08|
|Master (outer) case width||355|
|Master (outer) case length||529|
|Master (outer) case height||250|
|Quantity per master (outer) case||12|
Ports & interfaces